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Features
* * * * * * * *
TC1221/TC1222
General Description
The TC1221/TC1222 are CMOS "charge-pump" voltage converters in ultra-small 6-Pin SOT-23A packages. They invert and/or double an input voltage which can range from +1.8V to +5.5V. Conversion efficiency is typically 96%. Switching frequency is 125kHz for the TC1221, 750kHz for the TC1222. When the shutdown pin is held at a logic low, the device goes into a very low power mode of operation, consuming less than 1A of supply current. For standard voltage inverter applications, the device requires only two external capacitors. With a few additional components a positive doubler can also be built. All other circuitry, including control, oscillator, power MOSFETs are integrated on-chip. Typical supply currents are 290A (TC1221) and 1800A (TC1222). All devices are available in 6-pin SOT-23A surface mount packages.
High Frequency Switched Capacitor Voltage Converters with Shutdown in SOT Packages
Charge Pumps in 6-Pin SOT-23A Package 96% Voltage Conversion Efficiency Voltage Inversion and/or Doubling Operates from +1.8V to +5.5V Up to 25mA Output Current Only Two External Capacitors Required Power-Saving Shutdown Mode Fully Compatible with 1.8V Logic Systems
Applications
* * * * * LCD Panel Bias Cellular Phones Pagers PDAs, Portable Data Loggers Battery-Powered Devices
Device Selection Table
Part Number Package Osc. Freq. (kHz) 125 750 Operating Temp. Range -40C to +85C -40C to +85C
Functional Block Diagram
Negative Voltage Inverter
C+ + C1 C- VIN Input
TC1221ECH 6-Pin SOT-23A TC1222ECH 6-Pin SOT-23A
TC1221 TC1222
ON SHDN OFF V- Output C2 +
Package Type
6-Pin SOT-23A
OUT
C+ 6
SHDN 5
GND 4
GND
TC1221ECH TC1222ECH
1 OUT 2 VIN 3 C-
NOTE: 6-Pin SOT-23A is equivalent to the EIAJ SC-74
2002 Microchip Technology Inc.
DS21367B-page 1
TC1221/TC1222
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage (VIN to GND)....................... +6.0V, -0.3V Output Voltage (OUT to GND).................. -6.0V, +0.3V Current at OUT Pin..............................................50mA Short-Circuit Duration - OUT to GND ............Indefinite Power Dissipation (TA 70C) 6-Pin SOT-23A .........................................240mW Operating Temperature Range.............-40C to +85C Storage Temperature (Unbiased) .......-65C to +150C
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
TC1121 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = -40C to +85C, VIN = +5V, C1 = C2 = 1F, (TC1221), C1 = C2 = 0.22F (TC1222), Typical values are at TA = +25C. Symbol IDD ISHDN VMIN VMAX FOSC VIH VIL PEFF VEFF ROUT TWK
Note 1: 2:
Parameter Supply Current Shutdown Supply Current Minimum Supply Voltage Maximum Supply Voltage Oscillator Frequency SHDN Input Logic High SHDN Input Logic Low Power Efficiency Voltage Conversion Efficiency Output Resistance Wake-up Time From Shutdown Mode
Min -- -- -- 1.8 -- 81 550 1.4 -- -- -- 94 -- -- -- --
Typ 290 1800 0.01 -- -- 125 750 -- 90 70 96 25 80 25
Max 600 2800 1.0 -- 5.5 169 950 -- 0.4 -- -- -- 65 -- --
Units
A A
Device TC1221 TC1222
Test Conditions
SHDN = GND, VIN = 5V (Note 2) RLOAD = 1k RLOAD = 1k TC1221 TC1222 VIN = VMIN to VMAX VIN = VMIN to VMAX TC1221 TC1222 RLOAD = 1k RLOAD = ILOAD = 0.5mA to 25mA (Note 1) TC1221 TC1222 RLOAD = 1k
V V kHz V V % %
sec
Capacitor contribution is approximately 20% of the output impedance [ESR = 1/ pump frequency x capacitance]. VIN is guaranteed to be disconnected from OUT when the converter is in shutdown..
DS21367B-page 2
2002 Microchip Technology Inc.
TC1221/TC1222
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (6-Pin SOT-23A) 1 2 3 4 5 6
PIN FUNCTION TABLE
Symbol OUT VIN C- GND SHDN C
+
Description Inverting charge pump output. Positive power supply input. Commutation capacitor negative terminal. Ground. Shutdown input (active low). Commutation capacitor positive terminal.
2002 Microchip Technology Inc.
DS21367B-page 3
TC1221/TC1222
3.0 DETAILED DESCRIPTION
FIGURE 3-1:
The TC1221/TC1222 charge pump converters invert the voltage applied to the VIN pin. Conversion consists of a two-phase operation (Figure 3-1). During the first phase, switches S2 and S4 are opened and S1 and S3 are closed. During this time, C1 charges to the voltage on VIN and load current is supplied from C2. During the second phase, S2 and S4 are closed, and S1 and S3 are opened. This action connects C1 across C2, restoring charge to C2.
IDEAL SWITCHED CAPACITOR CHARGE PUMP
S2
S1 VIN C1
TC1221/1222
C2 S3 S4 VOUT = - (VIN)
OSC
Phase 1
DS21367B-page 4
2002 Microchip Technology Inc.
TC1221/TC1222
4.0
4.1
APPLICATIONS INFORMATION
Output Voltage Considerations
EQUATION 4-2:
PLOSS(4) = [(0.5)(C1)(VIN2 - VOUT2) + (0.5) (C2)(VRIPPLE2 - 2VOUT VRIPPLE)] x fOSC
The TC1221/TC1222 perform voltage conversion but do not provide regulation. The output voltage will droop in a linear manner with respect to load current. The value of this equivalent output resistance is approximately 25 nominal at +25C and VIN = +5V. VOUT is approximately -5V at light loads, and droops according to the equation below: VDROP = IOUT x ROUT VOUT = - (VIN - VDROP)
EQUATION 4-3:
VRIPPLE = [ IOUT / 2 x ( fOSC) (C2)] + 2 ( IOUT) (ESRC2)
FIGURE 4-1:
f V+
IDEAL SWITCHED CAPACITOR MODEL
4.2
Charge Pump Efficiency
VOUT
The overall power efficiency of the charge pump is affected by four factors: 1. Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). I2R losses due to the on-resistance of the MOSFET switches on-board the charge pump. Charge pump capacitor losses due to effective series resistance (ESR). Losses that occur during charge transfer (from the commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exists.
C1
C2
RL
FIGURE 4-2:
REQUIV V+ REQUIV = 1 f x C1
2. 3. 4.
EQUIVALENT OUTPUT RESISTANCE
VOUT
C2
RL
Most of the conversion losses are due to factors (2) and (3) above. These losses are given by Equation 4-1(b).
4.3
Capacitor Selection
EQUATION 4-1:
a) PLOSS (2, 3) = IOUT2 x ROUT b) where ROUT = [ 1 / [fOSC(C1) ] + 8RSWITCH + 4ESRC1 + ESRC2] The 1/(fOSC)(C1) term in Equation 4-1(b) is the effective output resistance of an ideal switched capacitor circuit (Figure 4-1 and Figure 4-2). The value of RSWITCH can be approximated at 0.5 for the TC1221/TC1222. The remaining losses in the circuit are due to factor (4) above, and are shown in Equation 4-2. The output voltage ripple is given by Equation 4-3.
In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 will lower the output resistance and larger values of C2 will reduce output ripple. (Equation 4-1(b) and Equation 4-3).
2002 Microchip Technology Inc.
DS21367B-page 5
TC1221/TC1222
Table 4-1 shows various values of C1 and the corresponding output resistance values @ +25C. It assumes a 0.1 ESRC1 and 2 RSWITCH. Table 4-2 shows the output voltage ripple for various values of C2. The VRIPPLE values assume 10mA output load current and 0.1 ESRC2.
4.5
Shutdown Input
The TC1221/TC1222 is enabled when SHDN is high, and disabled when SHDN is low. This input cannot be allowed to float. The SHDN input should be limited to 0.5V above VIN to avoid significant current flows.
TABLE 4-1:
OUTPUT RESISTANCE VS. C1 (ESR = 0.1)
TC1221 ROUT() 52.9 40.8 33.5 25 TC1222 ROUT() 22.6 20.5 19.4 17.8
4.6
Voltage Inverter
C1 (F) 0.22 0.33 0.47 1.0
The most common application for charge pump devices is the inverter (Figure 4-3). This application uses two external capacitors: C1 and C2 (plus a power supply bypass capacitor, if necessary). The output is equal to -VIN plus any voltage drops due to loading. Refer to Table 4-1 and Table 4-2 for capacitor selection.
FIGURE 4-3:
VOLTAGE INVERTER TEST CIRCUIT
C3 + VIN
TABLE 4-2:
OUTPUT VOLTAGE RIPPLE VS. C2 (ESR = 0.1) IOUT 10mA
TC1221 VRIPPLE (mV) 184 123 87 42 TC1222 VRIPPLE (mV) 32 22 16 9
2 1 OUT
C2 (F) 0.22 0.33 0.47 1.0
VOUT 6 C1+ + C1 4 + C2 RL
TC1221 IN TC1220
GND
4.4
Input Supply Bypassing
3 C1- 5 SHDN
The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the internal switching of the device. The recommended capacitor depends on the configuration of the TC1221/TC1222.
Device TC1221 TC1222
C1 1F 0.22F
C2 1F 0.22F
C3 1F 0.22F
DS21367B-page 6
2002 Microchip Technology Inc.
TC1221/TC1222
4.7 Cascading Devices 4.8 Paralleling Devices
Two or more TC1221/TC1222 can be cascaded to increase output voltage (Figure 4-4). If the output is lightly loaded, it will be close to (-2 x VIN) but will droop at least by ROUT of the first device multiplied by the IQ of the second. It can be seen that the output resistance rises rapidly for multiple cascaded devices. To reduce the value of ROUT, multiple TC1221/ TC1222's can be connected in parallel (Figure 4-5). The output resistance will be reduced by a factor of N where N is the number of TC1221/TC1222. Each device will require its own pump capacitor (C1), but all devices may share one reservoir capacitor (C2). However, to preserve ripple performance the value of C2 should be scaled according to the number of paralleled TC1221/TC1222.
FIGURE 4-4:
CASCADING MULTIPLE DEVICES TO INCREASE OUTPUT VOLTAGE
... VIN 2 3 C1 + VIN 6 5 "1" SHDN 1 ... C2 + VOUT = -nVIN 4 3 2
TC1221 TC1222
C1 +
4 6 5
TC1221 TC1222
"n" SHDN C2 + 1 VOUT
FIGURE 4-5:
PARALLELING MULTIPLE DEVICES TO REDUCE OUTPUT RESISTANCE
ROUT = ROUT OF SINGLE DEVICE NUMBER OF DEVICES VIN 2 3 4 + 6 5 "1" SHDN ... VOUT = -VIN Shutdown Control + C2 1 3 ... 2 VIN
C1
TC1221 TC1222
C1 +
4
TC1221 TC1222
1 VOUT
6 "n" 5 SHDN
2002 Microchip Technology Inc.
DS21367B-page 7
TC1221/TC1222
4.9 Voltage Doubler/Inverter 4.10 Diode Protection for Heavy Loads
Another common application of the TC1221/TC1222 is shown in Figure 4-6. This circuit performs two functions in combination. C1 and C2 form the standard inverter circuit described above. C3 and C4 plus the two diodes form the voltage doubler circuit. C1 and C3 are the pump capacitors and C2 and C4 are the reservoir capacitors. Because both sub-circuits rely on the same switches if either output is loaded, both will droop toward GND. Make sure that the total current drawn from both the outputs does not total more than 40mA. When heavy loads require the OUT pin to sink large currents being delivered by a positive source, diode protection may be needed. The OUT pin should not be allowed to be pulled above ground. This is accomplished by connecting a Schottky diode (1N5817) as shown in Figure 4-7.
4.11
Layout Considerations
As with any switching power supply circuit, good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Noise leakage into other circuitry can be minimized with the use of a large ground plane.
FIGURE 4-6:
COMBINED DOUBLER AND INVERTER
VIN D1, D2 = 1N4148
3 C1 + 4
2
TC1221 TC1222
1
D1
6 5
VOUT = -VIN C2 + D2 VOUT = (2VIN) - (VFD1) - (VFD2) C4
+ C3 Shutdown Control +
FIGURE 4-7:
HIGH V- LOAD CURRENT
GND 4
TC1221 TC1222
OUT 1
DS21367B-page 8
2002 Microchip Technology Inc.
TC1221/TC1222
5.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure 4-3, VIN = +5V, C1 = C2 = C3, TA = 25C unless otherwise noted.
TC1221 Supply Current vs. Supply Voltage
350 SUPPLY CURRENT (A)
OUTPUT VOLTAGE DROOP (mV)
300 250 200 150 100 50 1.5
C1 = C2 = C3 = 1F, RL = , +25C
TC1221 Output Voltage Droop vs. Capacitance, C1 = C2
600 500 400 300 200 100 0 VIN = 5.0V VIN = 3.3V VIN = 3.3V, RL = 1K, +25C VIN = 5.0V, RL = 1K, +25C
2.0
2.5
3.0 3.5 4.0 4.5 SUPPLY VOLTAGE (V)
5.0
5.5
TC1221 Output Resistance vs. Supply Voltage
OUTPUT RESISTANCE (Ohms)
0
5 10 CAPACITANCE (F)
15
65 60 55 50 45 40 35 1.5 2.0 2.5 3.0 3.5 4.0 4.5 SUPPLY VOLTAGE (V) 5.0 5.5
OSCILLATOR FREQUENCY (kHz) 130 C1 = C2 = C3 = 1F, RL = , +25C 120
C1 = C2 = C3 = 1F, +25C
TC1221 Oscillator Frequency vs. Supply Voltage
110
100
TC1221 Output Voltage Ripple vs. Capacitance, C2
OUTPUT VOLTAGE RIPPLE (mVp-p) 300 250 200 150 VIN = 5.0V 100 50 0 0 5 10 CAPACITANCE (F) 15 VIN = 3.3V VIN = 3.3V, RL = 1K, +25C VIN = 5.0V, RL = 1K, +25C
90 1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
2002 Microchip Technology Inc.
DS21367B-page 9
TC1221/TC1222
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
TC1222 Supply Current vs. Supply Voltage
1750 SUPPLY CURRENT (A) 1500 1250 1000 750 500 250 1.5 C1 = C2 = C3 = 0.22F, RL = , +25C
TC1222 Output Voltage Droop vs. Capacitance, C1 = C2
500 OUTPUT VOLTAGE DROOP (mV) 450 400 350 300 250 200 150 100 0 1 2 3 CAPACITANCE (F) 4 5 VIN = 5.0V VIN = 3.3V VIN = 3.3V, RL = 1K, +25C VIN = 5.0V, RL = 1K, +25C
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
TC1222 Output Resistance vs. Supply Voltage
OUTPUT RESISTANCE (Ohms) 65 C1 = C2 = C3 = 0.22F, +25C 60 55 50 45 40 35 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V)
OSCILLATOR FREQUENCY (kHz)
TC1222 Oscillator Frequency vs. Supply Voltage
750 C1 = C2 = C3 = 0.22F, RL = , +25C
700
650
600
TC1222 Output Voltage Ripple vs. Capacitance , C2
OUTPUT VOLTAGE RIPPLE (mVp-p) 160 VIN = 3.3V, RL = 1K, +25C VIN = 5.0V, RL = 1K, +25C 120 VIN = 5.0V 80 VIN = 3.3V
550 500 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V)
40
0 0 1 2 3 CAPACITANCE (F) 4 5
DS21367B-page 10
2002 Microchip Technology Inc.
TC1221/TC1222
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
1
&
2
= part number code + temperature range (two-digit code)
Code GA GB
TC1221/TC1222 TC1221ECH TC1222ECH
ex: 1221ECH = G A 1222ECH = G B
3 4
represents year and 2-month code represents production lot ID code
6.2
Taping Form
Component Taping Orientation for 6-Pin SOT-23A (EIAJ SC-74) Devices
User Direction of Feed
Device Marking
PIN 1 Standard Reel Component Orientation For TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
6-Pin SOT-23A
8 mm
4 mm
3000
7 in
2002 Microchip Technology Inc.
DS21367B-page 11
TC1221/TC1222
6.3 Package Dimensions
SOT-23A-6
.075 (1.90) REF.
.122 (3.10) .098 (2.50) .020 (0.50) .014 (0.35)
.069 (1.75) .059 (1.50)
.037 (0.95) REF. .118 (3.00) .110 (2.80)
.057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00)
10 MAX. .024 (0.60) .004 (0.10)
.008 (0.20) .004 (0.09)
Dimensions: inches (mm)
DS21367B-page 12
2002 Microchip Technology Inc.
TC1221/TC1222
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21367B-page13
TC1221/TC1222
NOTES:
DS21367B-page14
2002 Microchip Technology Inc.
TC1221/TC1222
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
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Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21367B-page 15
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DS21367B-page 16
2002 Microchip Technology Inc.

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